• CSAM ACOUSTIC MICROSCOPY |
Nordson Sonoscan’s Acoustic Micro Imaging technology collects the highest resolution data from all three dimensions of a sample, creating a virtual sample from which minute defects and features can be detected. Resolution in the micron range and delaminations as small as 200 Angstroms are typical. Our proprietary signal processing provides the most dependable and acoustically accurate information about a sample and its internal structure. Our advanced Acoustic Impedance Polarity Detector (AIPD)™ will allow you to measure the relative phase of interface reflections (echoes) to indicate the nature of the material at the other side of an interface. In addition, a Sonoscan acoustic image, that can have more than 256 megapixels and the highest pixel density, along with our data accuracy is one of the reasons that Sonoscan is typically the last word in failure analysis issues. |
• MULTIPURPOSE BOND TESETING |
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bondtesting in the volume manufacturing environment. Recognized as the industry standard, Nordson DAGE has a truly global presence and takes pride in delivering support to both local and international organizations alike. |
• REAL TIME X-RAY • 3D X-RAY TOMOGRAPHY |
Nordson DAGE, the leaders in X-ray inspection for the electronics industry offers the highest feature recognition and resolution X-ray systems not only within failure analysis laboratories but also within the production environment. It is now proud to launch its 4th generation, ultra-high resolution, off-line X-ray systems - the Quadra™ Series. The NEW Quadra™ Series has been designed with the user in mind and offers unbeatable image quality in the shortest possible time. With its revolutionary QuadraNT™ X-ray tube and Aspire FP™ detector, Nordson DAGE brings you the future of X-ray image resolution, reliability, performance and throughput. |
• HIGH RESOLUTION X-RAY • SUB MICRON RESOLUTION • SMALL FOOTPRINT • INLINE CAPABLE
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The XS-platform series is a small-footprint high-resolution automated X-ray inspection system concept designed for sophisticated high-speed inspection of semiconductor samples, wire bonds and PCB-assembly boards for single/multipanels or samples in trays. The inspectable applications range from component level inspection to mid-sized SMT boards. Just some of the possble applications include: LED, wire-sweep bondtest, sensors, solder joint inspection, power device cooling plates and PTH.
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