Reflow Systems | Conduction, Local and Vacuum Reflow Machine Quotes

Manual, Semi-Automatic and Fully Automatic Reflow Systems

• Sikama International - Falcon 5C

• Conduction and Convection Desktop Reflow Oven

• Reflow oven for small production volumes, high quality requirements

• Larger volumes and full automation available

• Fluxless AuSn, BGAs, double sided boards and large microwave components

• Minimal use of gas and electricity due to patented design

• centrotherm - c.Vacunite 12

• Quick heating and cooling for shorter cycle times

• Temperatures up to 450C

• Void reduction to less than 1%

• Suitible for High / Medium / Low volumes

• Supports fluxless, paste and flux attach.

• Surface activation options available

• Formic acid (HCOOH), forming gas (N2H2), Hydrogen (H2) and plasma

• Tresky Automation - T-600-L/G

• Complete die placer and attach system with 2.5um @ 3 sigma accuracy.

• Eutectic profiles, thermocompression and sintering options

• Exchangeable heads for pick, dispense and stamping operations

• Fully automatic die bonding with manual feed parts

• In-house production to protect your technology and provide short Time-to-Market

• Die bonding for small to medium production volumes, high quality requirements